Höyrynpurkauspinnoituksessa

Höyrynpurkauspinnoitus, often translated as vapor deposition or physical vapor deposition (PVD) in English, is a group of thin-film deposition methods used to produce thin solid films. In these processes, material from a solid or liquid source is vaporized, transported through a vacuum or inert gas, and then condensed onto a substrate as a thin film. This technique is widely employed across various industries, including microelectronics, optics, decorative coatings, and tool manufacturing, due to its ability to create films with precise thickness, composition, and properties.

The fundamental principle involves creating a vapor of the coating material and directing it towards the substrate. Several methods exist to achieve this vaporization. Sputtering involves bombarding a target material with energetic ions, causing atoms or molecules to be ejected and travel to the substrate. Evaporation uses heat (thermal evaporation) or electron beams (electron beam evaporation) to vaporize the source material, which then travels to the substrate. Another common technique is arc vapor deposition, which utilizes an electric arc to vaporize the source material.

The substrate is typically held at a controlled temperature during the deposition process. The vacuum environment is crucial to prevent contamination of the film by atmospheric gases and to ensure a clear path for the vaporized material. The resulting thin films can range in thickness from a few nanometers to several micrometers. Properties such as hardness, wear resistance, electrical conductivity, and optical reflectivity can be tailored by carefully selecting the source material, deposition parameters, and any subsequent post-treatment.