tinapinnoitus
Tinapinnoitus, or tin plating, is a metal finishing process in which a thin layer of tin is deposited onto a metal substrate, typically steel, iron, copper, or aluminum, to provide solderability, corrosion resistance, and surface protection. There are two main approaches: electroplating and electroless plating. In electroplating, tin is deposited from a tin-containing electrolyte onto the energized workpiece, usually after cleaning and activation. Electroless tin plating uses a chemical reducing agent to deposit tin without external current, offering uniform coatings on complex geometries.
Common substrates include steel, copper, and brass; aluminum is coated after proper pretreatment to ensure adhesion.
The process sequence typically involves cleaning, degreasing, surface activation, tin deposition, rinsing, and sometimes post-treatment such
A notable consideration in electronics is the formation of tin whiskers, slender metal projections that can
Tin plating remains a common method for improving solderability and corrosion resistance in both industrial and