processeswetting

Processeswetting is a concept in surface science that describes how wetting phenomena affect process-level outcomes. The term is not universally standardized, but it is used to emphasize the coupling between interfacial wetting properties and performance in manufacturing, materials processing, and surface engineering. Wetting is governed by interfacial tensions and surface energies, and dynamic wetting adds time-dependent effects such as spreading, pinning, and rebound that can alter rates, adhesion, and morphology in processes such as coating, printing, wet chemical processing, and electrochemical deposition.

Core concepts include contact angle, surface energy, interfacial tension, and the distinction between equilibrium and dynamic wetting. Roughness and texture modify apparent wetting through models like Wenzel and Cassie-Baxter, while dynamic models address advancing and receding angles. Experimental methods include goniometry, capillary rise, Wilhelmy plate measurements, and droplet impact tests. In practical settings, surface preparation, cleanliness, temperature, and ambient conditions can shift wetting and thereby process outcomes.

Applications cover paints and coatings, printing and coating technologies, biomedical devices, semiconductor manufacturing, catalysis, and porous materials processing. For example, efficient wetting promotes uniform film formation and adhesion in coatings; in inkjet printing, droplet spread influences resolution; in electrochemical deposition, wetting at the substrate controls coverage.

Challenges include reproducing wetting measurements across environments, controlling contamination, and integrating wetting data with process models. Ongoing work seeks standardized terminology and measurement protocols and to couple wetting models with transport and reaction kinetics for better process design.