planarisering
Planarisering is a term used in materials science and manufacturing to describe methods that achieve a flat, uniform surface by reducing topography variations across a substrate. The goal is to produce a near-ideal planar surface to enable reliable subsequent processing, such as lithography, deposition, bonding, or coating.
Common methods include chemical mechanical polishing (CMP), which uses a slurry with abrasive particles and a
Planarisering is critical in various industries. In microelectronics, it enables uniform layer thickness, reduces step height
Challenges include controlling surface planarity to within tight tolerances, preventing defects such as scratches or dishing