magnetronisputterointi
Magnetronisputterointi is a physical vapor deposition technique used to deposit thin films of various materials onto a substrate. It is a type of sputtering process that utilizes a magnetic field to enhance the ionization of the sputtering gas, typically argon. This magnetic field is applied around the target material, which is the source of the film being deposited. The magnetic field traps the electrons emitted from the target, increasing the probability of collisions with neutral gas atoms. These collisions create more ions, which are then accelerated towards the target, leading to a higher sputtering rate and more efficient deposition.
The magnetron sputtering system consists of a vacuum chamber, a target holder with magnets, a gas inlet,