lämpöpasteilla

Lämpöpasteilla, often translated as thermal paste or thermal compound, is a thermally conductive material applied as an interface between a heat-generating component and a heat sink. Its primary function is to fill microscopic air gaps between the two surfaces, which are typically not perfectly flat. Air is a poor conductor of heat, so by displacing it, thermal paste significantly improves the efficiency of heat transfer away from the component.

The effectiveness of thermal paste is measured by its thermal conductivity, usually expressed in watts per meter-Kelvin (W/m·K). Higher values indicate better heat transfer capabilities. Common ingredients include metal oxides, ceramics, carbon-based materials, and silicones. The consistency of thermal paste can range from a thick paste to a liquid-like substance, depending on the formulation and intended application.

In electronics, thermal paste is crucial for components that generate significant heat, such as CPUs and GPUs in computers. Without adequate thermal paste, these components can overheat, leading to performance throttling, instability, or permanent damage. It is also used in other applications like power transistors and LEDs to ensure optimal operating temperatures. Applying thermal paste is a standard procedure during the assembly or repair of electronic devices. The amount applied is important; too little will leave air gaps, while too much can create an insulating layer and potentially spill onto surrounding components.