lämpöpasteilla
Lämpöpasteilla, often translated as thermal paste or thermal compound, is a thermally conductive material applied as an interface between a heat-generating component and a heat sink. Its primary function is to fill microscopic air gaps between the two surfaces, which are typically not perfectly flat. Air is a poor conductor of heat, so by displacing it, thermal paste significantly improves the efficiency of heat transfer away from the component.
The effectiveness of thermal paste is measured by its thermal conductivity, usually expressed in watts per
In electronics, thermal paste is crucial for components that generate significant heat, such as CPUs and GPUs