interposeri

An interposer is a specialized component used in semiconductor packaging to facilitate electrical connections between different semiconductor chips or between a chip and a substrate. It acts as an intermediary, providing a bridge for signals and power. Interposers can be made from various materials, including silicon, organic substrates, or ceramic. They are particularly useful when there is a mismatch in the form factor or connection density required by the chips involved.

Silicon interposers are common for high-performance applications due to their ability to support very fine pitch connections, often referred to as Through-Silicon Vias (TSVs). These TSVs are vertical electrical connections that pass through the silicon interposer, allowing for dense and short signal paths. This leads to improved performance, reduced power consumption, and smaller overall package size. Organic interposers offer a more cost-effective solution for applications where the highest density is not critical. They are typically built using laminate technologies.

The primary function of an interposer is to route signals from one chip to another without requiring extensive routing on a larger, less efficient board. This is crucial in multi-chip modules (MCMs) and 2.5D/3D integrated circuits, where multiple dies are stacked or placed side-by-side. By placing an interposer between these components, manufacturers can achieve a much higher bandwidth and lower latency for communication between the chips. This technology is increasingly important for advanced processors, GPUs, memory modules, and other high-performance computing applications.