bumpbonding
Bump bonding is a semiconductor fabrication process used to create electrical interconnections between a semiconductor die and a substrate. It is a type of flip-chip technology where solder bumps are formed on the contact pads of the semiconductor die. These bumps are typically made of a solder alloy, such as gold-tin or tin-lead, and are deposited using techniques like electroplating or evaporation.
Once the solder bumps are formed on the die, the die is flipped over and aligned with
Bump bonding offers several advantages. It allows for a higher density of interconnections compared to wire