Trägermateriale

Trägermateriale, in German-language technical literature, denotes carrier materials or substrates that provide mechanical support and a surface for the deposition of coatings, films, or functional layers. They are used in electronics, photonics, energy storage, catalysis, and surface engineering. The choice of trägermaterial affects adhesion, thermal and chemical compatibility, and overall device performance.

Types include inorganic substrates such as silicon wafers, glass, sapphire, and alumina; metals and metal foils such as copper, aluminum, stainless steel; ceramics; and organic or polymer substrates such as polyimide, PET, polycarbonate, and PDMS. Flexible substrates enable bendable devices, while high-temperature ceramics enable robust optics or harsh environments. Some substrates also act as electrodes or diffusion barriers.

Key properties include thermal stability and coefficient of thermal expansion (CTE) matching to deposited layers, chemical resistance, surface energy and roughness, electrical conductivity, optical transparency, and mechanical strength. Surface preparation and conditioning (cleaning, polishing, and adhesion-promoters) are important to ensure uniform film growth.

Applications span semiconductor device fabrication (as silicon or III–V wafers), photovoltaics and OLEDs (glass, quartz, or plastic substrates), thin-film photovoltaics, batteries and supercapacitors (foil and foil-based substrates), sensors, and catalytic supports.

Selection considerations include CTE compatibility with films, chemical compatibility with processing chemistries, surface flatness and roughness, thermal conductivity, and cost. In manufacturing, substrates may undergo cleaning, coating, polishing, and pre-deposition treatments to improve adhesion and growth.

Examples: silicon wafers for microelectronics; fused silica for optics; PET or polyimide for flexible circuits; stainless steel foils for electrolytic cells.