Szilíciumszeletet

Szilíciumszeletet translates from Hungarian to "silicon wafer." A silicon wafer is a thin slice of semiconductor material, typically silicon, used as the base material in the fabrication of integrated circuits. These wafers are the foundation upon which microchips are built.

The production of silicon wafers involves a highly refined process. High-purity silicon is melted and then solidified into a large, single crystal ingot, usually through methods like the Czochralski process. This ingot is then precisely sliced into thin wafers. These wafers are then polished to an extremely smooth and defect-free surface, which is crucial for the intricate photolithography and etching processes that define the patterns of electronic components on the chip.

Silicon wafers come in various diameters, with common sizes being 150 mm (6 inches), 200 mm (8 inches), and 300 mm (12 inches). Larger wafer diameters allow for the production of more chips per wafer, leading to economies of scale and reduced manufacturing costs. The semiconductor industry relies heavily on these wafers as the fundamental substrate for virtually all modern electronic devices, from smartphones and computers to advanced medical equipment and automotive systems. The quality and purity of the silicon wafer directly impact the performance and reliability of the final microchip.