Sputterpinnoitus

Sputterpinnoitus is a term used in Finnish technical literature to describe the sputter coating process and the resulting thin film on a substrate. It denotes deposition of material from a solid target by energetic ions in a vacuum, typically via argon plasma.

In a sputter deposition system, a target material is bombarded by ions, ejecting atoms that travel to the substrate and form a film. Parameters such as discharge power, gas pressure, substrate temperature, and target–substrate distance determine growth rate, microstructure, and film stress. DC, RF, and magnetron configurations are common.

Films deposited by sputterpinnoitus include metals, oxides, nitrides, and multilayer stacks. Typical thickness ranges span from a few nanometers for optical coatings to several micrometers for wear-resistant or barrier layers. The process permits conformal coverage on complex geometries with controlled density and roughness.

Performance depends on adhesion, density, and stress, which are influenced by substrate cleanliness, temperature, and bias, as well as target composition. Common challenges include nonuniformity, pinholes, columnar growth, and residual stress that can lead to delamination or cracking.

Quality control relies on thickness and composition measurements (profilometry, X-ray reflectometry, ellipsometry, EDS), as well as adhesion and hardness testing. In Finnish practice, sputterpinnoitus is used interchangeably with sputter coating, though English literature may use the broader term physical vapor deposition.