PVDmenetelmässä
PVD stands for Physical Vapor Deposition. It is a general term for a group of thin film deposition methods. In PVD processes, atoms or molecules are vaporized from a source material, transported through a vacuum or low-pressure gas environment, and then condensed onto a substrate surface to form a thin film. This process is used to deposit a wide variety of materials, including metals, ceramics, and polymers.
There are several common types of PVD techniques. Sputtering involves bombarding a target material with energetic
PVD is widely employed in various industries due to its ability to produce high-quality, thin films with