Lichtkommunikation

Lichtkommunikation, also known as optical communication, is the transfer of information using light waves as the carrier medium. Unlike radio frequency communication, light has a much higher carrier frequency, allowing for data rates that are orders of magnitude greater. The term encompasses both fiber‑optic systems, where light travels through dielectric fibers, and free‑space optical links, where beams propagate through the atmosphere or vacuum.

The roots of light communication can be traced back to the 19th‑century experiments of Heinrich Hertz and later to the development of the optical fiber by Charles Kao and George Hockham in the 1960s. The first practical fiber‑optic telecommunication system appeared in the early 1970s, leading to the widespread adoption of fiber networks that form the backbone of global data traffic. More recent advancements include the launch of space‑to‑ground and inter‑satellite optical links, which offer high bandwidth and low latency for deep‑space missions.

Free‑space optical communication (FSO) uses directed laser beams or LEDs to transmit data between buildings, ships, or aircraft. It is valuable in situations where deploying physical cables is infeasible or where rapid, deployable links are required. In contrast, Li‑Fi (light fidelity) employs visible or infrared light emitted by LEDs to provide short‑range, high‑throughput wireless access within a room or office. Li‑Fi can coexist with Wi‑Fi, offering complementary coverage and improved security because light does not penetrate opaque walls.

Key performance metrics in light communication include bandwidth, attenuation, eye safety, co‑channel interference, and atmospheric effects such as fog, rain, or turbulence. Infrastructure costs, maintenance, and regulatory approvals, particularly for terrestrial laser links, also influence deployment decisions. As spectrum scarcity and demand for higher data rates grow, research continues into wavelength‑division multiplexing for fiber, adaptive modulation for FSO, and integration of photonic components onto silicon chips for cost‑effective consumer devices.