IPC2152

IPC-2152 is a standard published by IPC (Association Connecting Electronics Industries) that provides methods for determining and documenting the electrical and thermal performance of electronic equipment and assemblies. The standard focuses on establishing and expressing temperature rise and power dissipation under defined environmental conditions, so designers, manufacturers, test houses, and customers have a common basis for comparing components and systems.

Scope and purpose: IPC-2152 describes how to determine temperature rise for devices and assemblies, specifying the environmental conditions (such as ambient temperature, airflow, enclosure, and mounting) and the methods or models used (experimental testing or thermal calculations). It outlines reporting requirements, including the format for presenting data as a function of power or current, and the inclusion of assumptions and boundary conditions.

Key concepts: The standard emphasizes boundary conditions, conservative versus typical values, and the thermal path from a device to its surroundings. It covers heat transfer mechanisms such as conduction, convection, and radiation, and addresses how enclosure effects and mounting influence results. Derating guidance and the distinction between measured and predicted values are commonly considered in practice.

Applications and use: IPC-2152 is used in design validation, thermal budget planning, reliability forecasting, and supplier qualification. It is commonly employed alongside other IPC standards related to electronics design and manufacturing, helping to communicate thermal expectations between supply chain participants.

Limitations: While the standard provides a structured approach to characterizing thermal performance, real-world results depend on manufacturing tolerances, board layouts, and actual operating conditions, which may cause deviations from modeled or tested values.