soldeerfillet

Soldeerfillet refers to the smooth, concave, and continuous fillet of solder that forms the joint between two or more components in soldering. This shape is crucial for a strong and reliable electrical and mechanical connection. A well-formed solder fillet is typically shiny and exhibits wetting on both the component lead and the pad. The term "fillet" describes the curved transition between the surfaces being joined by the solder.

The formation of a proper solderfillet is dependent on several factors, including proper surface preparation, correct solder temperature, adequate solder material, and sufficient time for the solder to flow and wet the surfaces. Insufficient wetting can lead to a poor fillet, characterized by a dull, grainy, or frosty appearance, which indicates a weak joint susceptible to failure. Conversely, excessive solder can result in a large, convex fillet, which may not be desirable for space-constrained applications or can create stress points. The ideal solderfillet demonstrates good solder adhesion to both substrates, ensuring mechanical integrity and efficient electrical conductivity. It plays a vital role in the overall reliability of electronic assemblies and other soldered structures.