mikroabrasive

Mikroabrasive, or microabrasive, refers to abrasive particles with sizes in the micron or sub-micron range that are used to remove material and finish surfaces with high precision. These fine grains are employed in a variety of finishing processes, including lapping, polishing, grinding, and chemical–mechanical polishing. They can be supplied as bonded abrasives, loose powders, or as components of slurries.

Common microabrasive materials include silicon carbide, aluminum oxide, diamond, and cubic boron nitride. The particle size typically ranges from about 0.1 to 10 micrometers for microabrasives, with sub-micron fractions used for ultra-fine polishing and CMP slurries. Colloidal suspensions, such as colloidal silica, are widely used in semiconductor wafer polishing and other precision finishing applications.

Removal mechanisms depend on the process: abrasive particles remove material by micro-cutting and brittle fracture, often aided by chemical action in chemical–mechanical polishing. Applications span optical and glass polishing, metal and ceramic finishing, and microelectronics wafer planarization. Material choice and process parameters are selected to achieve the desired surface finish, planarity, and defect control.

Safety and environmental considerations include dust control and respiratory protection when handling fine powders, as well as proper disposal of slurry wastes. Performance is evaluated by metrics such as material removal rate, surface roughness, and defect density, which guide the selection of abrasive material, particle size, and process conditions.