lämmönsiirtogeeli

Lammonsiirtogeeli, often translated as thermal paste or thermal compound, is a substance used to fill microscopic air gaps between a heat-generating component, such as a CPU or GPU, and a heat sink. These air gaps are unavoidable due to imperfections in the surfaces of both components. Since air is a poor conductor of heat, these gaps significantly impede heat transfer. Lammonsiirtogeeli has a much higher thermal conductivity than air, allowing heat to flow more efficiently from the component to the heat sink, which then dissipates the heat into the surrounding environment.

The composition of lammonsiirtogeeli varies. Many common types are silicone-based, often containing metal oxides or other fillers to enhance their thermal conductivity. More advanced formulations might use ceramic or even metallic compounds. The application of lammonsiirtogeeli is typically a thin, even layer. Too much can act as an insulator, while too little may not adequately fill the air gaps. Proper application ensures optimal thermal performance, preventing components from overheating, which can lead to performance throttling or even permanent damage. It is a crucial component in the thermal management of many electronic devices, from personal computers to high-performance servers and gaming consoles.