etchable

Etchable refers to the ability of a material to be chemically or electrically modified by an etching process. In semiconductor manufacturing, materials such as silicon, gallium arsenide, and silicon dioxide are termed etchable when they can be selectively removed by plasma, wet chemistry, or reactive ion etching. The etchability of a substrate depends on its chemical composition, crystal structure, and surface bonds, as well as the etchant’s aggressiveness.

In microfabrication, etchable layers are routinely used to create precise patterns of transistors, interconnects, and contacts. Photolithography defines the areas to be etched, after which the chosen chemistry removes exposed regions. Common etchants include potassium hydroxide for silicon, hydrofluoric acid for silicon dioxide, and phosphoric acid for certain alloys.

Etchable properties are also crucial in metalworking, where etching is employed to clean surfaces or create decorative patterns. Copper, nickel, and steel can be etched by acidic, basic, or concentrated salt solutions. The term also applies to glass and polymer substrates in display fabrication and printed circuit board production, wherein acid or alcohol-based etchants remove copper layers or glass pads.

Materials that exhibit high selectivity—where the etchant removes one component rapidly while leaving others intact—are especially valuable. Advances in dry etching, such as deep reactive ion etching, have expanded the range of etchable materials and improved feature resolution. Understanding etchability enables engineers to design processes that achieve accurate dimensions, reduce material waste, and optimize device performance.