bufferSchichten

BufferSchichten, also known as buffer layers or interlayers, are thin films of material deposited between a substrate and a functional layer in a device. Their primary purpose is to improve the adhesion and compatibility between these two dissimilar materials. Without a bufferSchicht, direct deposition of a functional layer onto a substrate can lead to poor interfacial contact, increased stress, and ultimately, device failure.

The composition of a bufferSchicht is carefully chosen to bridge the chemical and physical differences between the substrate and the functional layer. For example, a bufferSchicht might be used to transition from a metal substrate to a ceramic functional layer. In such cases, the bufferSchicht could have a composition that is intermediate between the two, or it might possess properties that are conducive to bonding with both.

Common functions of bufferSchichten include stress reduction, preventing diffusion of atoms between layers, providing a chemically inert interface, and modifying surface energy to promote better wetting and adhesion. In applications like semiconductors, thin-film solar cells, and protective coatings, bufferSchichten play a crucial role in enhancing device performance and longevity. The thickness of bufferSchichten is typically in the nanometer to micrometer range, and their deposition often involves techniques such as sputtering, chemical vapor deposition (CVD), or atomic layer deposition (ALD). The selection and optimization of bufferSchichten are critical steps in the fabrication process of many advanced materials and devices.