Ohutkalvopinnoitus

Ohutkalvopinnoitus is a manufacturing process used to apply a thin layer of material onto a substrate. This layer, known as a thin film, can range in thickness from a few nanometers to several micrometers. The purpose of ohutkalvopinnoitus varies widely, but common goals include improving the surface properties of the substrate, such as hardness, wear resistance, electrical conductivity, optical characteristics, or corrosion resistance. The substrate material can be diverse, including metals, ceramics, polymers, and glass.

Several techniques exist for ohutkalvopinnoitus. Physical vapor deposition (PVD) methods, such as sputtering and evaporation, involve physically transferring material from a source to the substrate in a vacuum environment. Chemical vapor deposition (CVD) and its variations (e.g., plasma-enhanced CVD) utilize chemical reactions occurring at or near the substrate surface to form the thin film. Other methods include electroplating, electroless plating, and atomic layer deposition (ALD), each offering specific advantages for different applications and material combinations. The choice of technique depends heavily on the desired film material, substrate properties, film thickness, uniformity requirements, and economic considerations. Ohutkalvopinnoitus finds extensive use in industries like electronics, optics, automotive, aerospace, and medical devices.