Kuivsöövitustehnika
Kuivsöövitustehnika, also known as dry etching, is a microfabrication process used to remove material from a solid surface in a directional manner. It is commonly employed in the semiconductor industry to pattern thin films. Unlike wet etching, which uses liquid chemicals, dry etching utilizes a plasma or a stream of energetic ions to etch the substrate. This method offers greater control over the etching process, allowing for anisotropic etching, where material is removed primarily in a vertical direction, leading to well-defined structures with steep sidewalls.
The primary mechanism in dry etching involves reactive ions or neutral species generated in a plasma. These
Key advantages of dry etching include its precision, controllability, and ability to create high-aspect-ratio structures. It