Interposerenhanced
InterposerEnhanced refers to a technology that utilizes an interposer to improve the performance and functionality of semiconductor devices, particularly in advanced packaging. An interposer is a thin piece of material, often silicon, that acts as a bridge between different components, such as a processor and memory, or multiple chiplets. This bridging allows for a much higher density of electrical connections than traditional printed circuit boards, leading to reduced signal latency and increased bandwidth.
In an InterposerEnhanced system, the interposer facilitates a 2.5D or 3D integration of chips. This means that
The benefits of InterposerEnhanced technology include lower power consumption due to reduced trace lengths, improved thermal