Elektronisuihkuhöyrystys

Elektronisuihkuhöyrystys, often abbreviated as E-beam evaporation, is a physical vapor deposition (PVD) technique used for thin film deposition. In this process, a high-energy electron beam is directed at a solid source material, typically in a vacuum chamber. The electron beam causes the surface of the source material to heat up intensely, leading to evaporation or sublimation without significantly heating the rest of the material or the substrate.

The evaporated material then travels through the vacuum and condenses onto a substrate, forming a thin film. The pressure in the vacuum chamber is crucial, as it minimizes collisions between the evaporated atoms and gas molecules, ensuring a directional and pure deposition. The composition of the deposited film can be controlled by the choice of source material. For complex alloys or compounds, multiple electron beams can be used to evaporate different sources simultaneously or sequentially.

This method is known for its ability to deposit refractory materials with high melting points, such as metals, alloys, ceramics, and oxides. Elektronisuihkuhöyrystys offers advantages like high deposition rates, excellent film purity, and good control over film thickness and uniformity. It finds applications in various industries, including semiconductor manufacturing, optics (e.g., anti-reflective coatings), and protective coatings. The process requires specialized equipment due to the high-energy electron beam and the vacuum environment.