Kathodenzerstäubung

Kathodenzerstäubung is a physical vapor deposition technique used to deposit thin films onto a substrate. It is a form of sputtering where a target material, acting as the cathode, is bombarded by energetic ions in a vacuum chamber. These ions, typically from an inert gas like argon, are accelerated towards the cathode. When the ions strike the cathode surface, they transfer momentum to the target atoms, ejecting them from the target material in a process known as sputtering. The ejected atoms then travel through the vacuum and deposit onto the surface of a substrate, forming a thin film.

The process of Kathodenzerstäubung can be controlled by adjusting parameters such as the gas pressure, the applied voltage, and the distance between the cathode and the substrate. Different types of sputtering exist, including DC sputtering and RF sputtering, which are chosen based on the conductivity of the target material. DC sputtering is suitable for conductive targets, while RF sputtering is necessary for insulating targets. This technique is widely used in various industries, including semiconductor manufacturing, optics, and decorative coatings, due to its ability to produce uniform and high-quality thin films with precise control over thickness and composition.