Kõvajoodisjootmine

Kõvajoodisjootmine is a metal-joining process that uses a filler metal to create a bond between two or more metal workpieces. The filler metal, known as solder, has a melting point above 450 degrees Celsius (842 degrees Fahrenheit) but below the melting point of the base metals being joined. This distinction differentiates it from soft soldering, where lower melting point solders are used.

The process involves heating the base metals to a temperature that allows the filler metal to melt and flow into the joint via capillary action. Once the heat source is removed, the molten filler metal solidifies, creating a strong and permanent mechanical bond. Unlike welding, the base metals do not melt during the kõvajoodisjootmine process.

Common filler metals for kõvajoodisjootmine include alloys of silver, copper, and nickel. Flux is typically applied to the joint surfaces to clean them of oxides and other contaminants, preventing re-oxidation during heating and promoting the wetting and flow of the molten solder.

Kõvajoodisjootmine is widely used in various industries, including plumbing, HVAC, electronics, and manufacturing, due to its ability to create strong, leak-proof joints in a variety of metals such as copper, brass, steel, and stainless steel. It is a versatile technique suitable for joining dissimilar metals and creating complex assemblies. The strength of the joint depends on the filler metal used and the proper execution of the process.